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ORCIDMicroelectronics Reliability, Volume 85
Volume 85, June 2018
- Golta Khatibi, A. Betzwar Kotas, Martin Lederer
:
Effect of aging on mechanical properties of high temperature Pb-rich solder joints. 1-11 - Josef Hylský, Dávid Strachala, Petr Vyroubal, Pavel Cudek, Jirí Vanek, Petr Vanýsek:
Effect of negative potential on the extent of PID degradation in photovoltaic power plant in a real operation mode. 12-18 - Junji Sakamoto, Ryoma Hirata, Tadahiro Shibutani:
Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test. 19-24 - Canras Batunlu, Al-Hussein Albarbar:
Strategy for enhancing reliability and lifetime of DC-AC inverters used for wind turbines. 25-37 - Yiyuan Li, Jianhua Li, Lixin Xu:
Failure mode analysis of MEMS suspended inductors under mechanical shock. 38-48
- Gerhard Rzepa, Jacopo Franco, Barry J. O'Sullivan, A. Subirats, Marko Simicic, Geert Hellings, Pieter Weckx, Markus Jech, Theresia Knobloch, Michael Waltl, Philippe Roussel, Dimitri Linten, Ben Kaczer, Tibor Grasser:
Comphy - A compact-physics framework for unified modeling of BTI. 49-65 - Junyeap Kim, Hanbin Yoo, Heesung Lee, Seong Kwang Kim, Sungju Choi, Sung-Jin Choi, Dae Hwan Kim, Dong Myong Kim:
Comprehensive separate extraction of parasitic resistances in MOSFETs considering the gate bias-dependence and the asymmetric overlap length. 66-70 - Jian-Xun Zhang, Xiao-Sheng Si, Dang-Bo Du, Chang-Hua Hu:
Specification analysis of the deteriorating sensor for required lifetime prognostic performance. 71-83
- Péter Pálovics, Ferenc Ender, Márta Rencz:
Towards the CFD model of flow rate dependent enzyme-substrate reactions in nanoparticle filled flow microreactors. 84-92 - Yiming Qu, Bing Chen, Wei Liu, Jinghui Han, Jiwu Lu, Yi Zhao:
Sub-1 ns characterization methodology for transistor electrical parameter extraction. 93-98 - Qi Zhao, Xiaoli Qin, Hongbo Zhao, Wenquan Feng:
A novel prediction method based on the support vector regression for the remaining useful life of lithium-ion batteries. 99-108
- Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey:
Design, manufacture and test for reliable 3D printed electronics packaging. 109-117 - Qingwei Zhang, Ping Li, Yongbo Liao, Gang Wang, Rongzhou Zeng, Heng Wang:
A reverse hysteresis effect of graphene transistors with amorphous silicon gate dielectric. 118-121 - Richard McWilliam, Samir Khan, Michael Farnsworth, Colin Bell:
Zero-maintenance of electronic systems: Perspectives, challenges, and opportunities. 122-139 - Shipeng Yi, Zhengwei Du:
The influence of microwave pulse width on the thermal burnout effect of an LNA constructed by a GaAs PHEMT. 140-147
- Siyang Hu, Chengdong Yuan, Alessandro Castagnotto, Boris Lohmann, Sofiane Bouhedma, Dennis Hohlfeld, Tamara Bechtold:
Stable reduced order modeling of piezoelectric energy harvesting modules using implicit Schur complement. 148-155 - Shipeng Yi, Zhengwei Du:
The influence of microwave pulse repetition frequency on the thermal burnout effect of a PIN diode limiting-amplifying system. 156-162 - Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann:
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. 163-175 - Jorge Loayza, Nicolas Guitard, Bruno Allard, Luong-Viêt Phung, Blaise Jacquier, Philippe Galy:
Simulation, characterization and implementation of a new SCR-based device with a turn-off capability for EOS-immune ESD power supply clamps in advanced CMOS technology nodes. 176-189 - Masoomeh Karami, Athena Abdi, Hamid R. Zarandi:
A cross-layer aging-aware task scheduling approach for multiprocessor embedded systems. 190-197
- László Pohl, Zsolt Kohári, András Poppe:
Vertical natural convection models and their effect on failure analysis in electro-thermal simulation of large-surface OLEDs. 198-206 - Zhihua Wang, Qiong Wu, Xiongjian Zhang, Xinlei Wen, Yongbo Zhang, Chengrui Liu, Huimin Fu:
A generalized degradation model based on Gaussian process. 207-214
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