"Integrated Through-Silicon Via Placement and Application Mapping for 3D ..."

Kanchan Manna et al. (2016)

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type: Journal Article

metadata version: 2020-09-08

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Kanchan Manna, Shivam Swami, Santanu Chattopadhyay, Indranil Sengupta:
Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design. ACM Trans. Embed. Comput. Syst. 16(1): 24:1-24:25 (2016)

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