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"Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and ..."
Jacob Dawes et al. (2024)
- Jacob Dawes

, Tzu-Hsuan Chou
, Boyu Shen
, Matthew L. Johnston
:
Microfluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects. IEEE Trans. Biomed. Circuits Syst. 18(4): 821-833 (2024)

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