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"Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using ..."
Dong Liu et al. (2019)
- Dong Liu

, Chek Sing Teo
, Wenyu Liang
, Kok Kiong Tan:
Soft-Acting, Noncontact Gripping Method for Ultrathin Wafers Using Distributed Bernoulli Principle. IEEE Trans Autom. Sci. Eng. 16(2): 668-677 (2019)

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