"A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in ..."

Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin (2009)

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DOI: 10.1109/JPROC.2008.2007466

access: closed

type: Journal Article

metadata version: 2020-10-02

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Luigi Pietro Maria Colombo, Davide Paleari, Alexey Petrushin:
A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages. Proc. IEEE 97(1): 70-77 (2009)

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