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"High temperature reliability and interfacial reaction of eutectic ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Jeong-Won Yoon, Seung-Boo Jung (2006)

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DOI: 10.1016/J.MICROREL.2005.05.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jeong-Won Yoon, Seung-Boo Jung:
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectron. Reliab. 46(5-6): 905-914 (2006)

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