"The effect of reflow process on the contact resistance and reliability of ..."

Chunyan Yin et al. (2003)

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DOI: 10.1016/S0026-2714(02)00348-7

access: closed

type: Journal Article

metadata version: 2022-07-20

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Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43(4): 625-633 (2003)

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