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"Optimizing the fine-pitch copper wire bonding process with multiple ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Jun-Hsien Yeh, Tsung-Nan Tsai (2014)

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DOI: 10.1016/J.MICROREL.2013.09.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jun-Hsien Yeh, Tsung-Nan Tsai:
Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method. Microelectron. Reliab. 54(1): 287-296 (2014)

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