"Pb-free high temperature solders for power device packaging."

Yasushi Yamada et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.083

access: closed

type: Journal Article

metadata version: 2023-09-30

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Yasushi Yamada, Yoshikazu Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Yuji Sutou, R. Kainuma, Kiyohito Ishida:
Pb-free high temperature solders for power device packaging. Microelectron. Reliab. 46(9-11): 1932-1937 (2006)

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