"Dynamic strength of anisotropic conductive joints in flip chip on glass ..."

Y. P. Wu et al. (2004)

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DOI: 10.1016/S0026-2714(03)00214-2

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type: Journal Article

metadata version: 2022-07-20

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Y. P. Wu, M. O. Alam, Yan Cheong Chan, B. Y. Wu:
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectron. Reliab. 44(2): 295-302 (2004)

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