"Study of factors affecting warpage of HFCBGA subjected to reflow ..."

Tong Hong Wang et al. (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2012.08.006

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WangTLL13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WangTLL13
Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai:
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectron. Reliab. 53(2): 297-302 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.