"Integrated vapor pressure, hygroswelling, and thermo-mechanical stress ..."

Tong Yan Tee, Zhaowei Zhong (2004)

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DOI: 10.1016/J.MICROREL.2003.07.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Zhaowei Zhong:
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. Microelectron. Reliab. 44(1): 105-114 (2004)

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