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"A quantitative method of reliability estimation for surface mount solder ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Bo Tao et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.04.013

access: closed

type: Journal Article

metadata version: 2025-11-06

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Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong:
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q_eta. Microelectron. Reliab. 46(5-6): 864-872 (2006)

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