"Effect of vacuum break after the barrier layer deposition on the ..."

Cher Ming Tan et al. (2005)

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DOI: 10.1016/J.MICROREL.2005.07.045

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type: Journal Article

metadata version: 2022-09-27

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Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low:
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. Microelectron. Reliab. 45(9-11): 1449-1454 (2005)

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