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"An investigation of reliability of solder joints in microelectronic ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Haixia Shang et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.12.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Haixia Shang, Jianxin Gao, Pascual Ian Nicholson, Steve Kenny:
An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method. Microelectron. Reliab. 51(5): 994-1002 (2011)

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