"Effect of test condition and stress free temperature on the ..."

Arijit Roy et al. (2005)

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DOI: 10.1016/J.MICROREL.2005.07.042

access: closed

type: Journal Article

metadata version: 2022-09-27

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Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen:
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectron. Reliab. 45(9-11): 1443-1448 (2005)

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