"Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded ..."

Frédéric Richardeau et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.07.031

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type: Journal Article

metadata version: 2025-11-15

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Frédéric Richardeau, Zhifeng Dou, Emmanuel Sarraute, Jean-Marc Blaquière, Didier Flumian:
Comparison of IGBT short-circuit failure "ohmic mode": Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters. Microelectron. Reliab. 51(9-11): 1919-1926 (2011)

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