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"Study on low-Ag content Sn-Ag-Zn/Cu solder joints."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Tingbi Luo et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.06.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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  dblp key:
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  - https://dblp.org/rec/journals/mr/LuoCHLL13
Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li:
Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectron. Reliab. 53(12): 2018-2029 (2013)

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