"Stacked solder bumping technology for improved solder joint reliability."

Xingsheng Liu et al. (2001)

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DOI: 10.1016/S0026-2714(01)00117-2

access: closed

type: Journal Article

metadata version: 2026-04-07

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Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Stacked solder bumping technology for improved solder joint reliability. Microelectron. Reliab. 41(12): 1979-1992 (2001)

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