"Effects of length scaling on electromigration in dual-damascene copper ..."

M. H. Lin, M. T. Lin, Tahui Wang (2008)

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DOI: 10.1016/J.MICROREL.2007.10.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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M. H. Lin, M. T. Lin, Tahui Wang:
Effects of length scaling on electromigration in dual-damascene copper interconnects. Microelectron. Reliab. 48(4): 569-577 (2008)

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