"IR thermography and FEM simulation analysis of on-chip temperature during ..."

Helmut Köck et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.06.032

access: closed

type: Journal Article

metadata version: 2024-10-06

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Helmut Köck, Vladimír Kosel, Christian Djelassi, Michael Glavanovics, Dionyz Pogany:
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures. Microelectron. Reliab. 49(9-11): 1132-1136 (2009)

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