"Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu ..."

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung (2006)

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DOI: 10.1016/J.MICROREL.2005.06.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung:
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectron. Reliab. 46(2-4): 535-542 (2006)

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