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"Determination of adhesion and delamination prediction for semiconductor ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Michael Goroll, Reinhard Pufall (2012)

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DOI: 10.1016/J.MICROREL.2012.06.054

access: closed

type: Journal Article

metadata version: 2020-02-22

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Michael Goroll, Reinhard Pufall:
Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling. Microelectron. Reliab. 52(9-10): 2289-2293 (2012)

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