"From chip to inverter: Electro-thermal modeling and design for paralleled ..."

Peng Fan et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.03.040

access: closed

type: Journal Article

metadata version: 2020-02-22

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Peng Fan, Shoudao Huang, Huai Wang, Huimin Li, Derong Luo:
From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application. Microelectron. Reliab. 87: 271-277 (2018)

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