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"Investigation of the heel crack mechanism in Al connections for power ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Y. Celnikier et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.01.001

access: closed

type: Journal Article

metadata version: 2024-01-25

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Y. Celnikier, Lahouari Benabou, Laurent Dupont, Gerard Coquery:
Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectron. Reliab. 51(5): 965-974 (2011)

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