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"High-temperature reliability of Flip Chip assemblies."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Tanja Braun et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.06.004

access: closed

type: Journal Article

metadata version: 2021-09-02

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Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl:
High-temperature reliability of Flip Chip assemblies. Microelectron. Reliab. 46(1): 144-154 (2006)

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