"A practical investigation on nickel plated copper heat spreader with ..."

Nowshad Amin et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.02.013

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type: Journal Article

metadata version: 2020-02-22

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Nowshad Amin, Victor Lim, Foong Chee Seng, Rozaidi Razid, Ibrahim Ahmad:
A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages. Microelectron. Reliab. 49(5): 537-543 (2009)

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