"Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu ..."

Bakhtiar Ali et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.01.015

access: closed

type: Journal Article

metadata version: 2023-09-30

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Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard:
Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectron. Reliab. 82: 171-178 (2018)

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