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"Analysis and optimization of bending vibration mechanical properties of ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Junjian Li et al. (2026)

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DOI: 10.1016/J.MEJO.2026.107281

access: closed

type: Journal Article

metadata version: 2026-06-17

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  - https://dblp.org/rec/journals/mj/LiHHLW26
Junjian Li, Long Huang, Chunyue Huang, Ying Lu, Gui Wang:
Analysis and optimization of bending vibration mechanical properties of underfill BGA solder joints. Microelectron. J. 175: 107281 (2026)

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