"Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs."

Shreepad Panth et al. (2014)

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DOI: 10.6109/JICCE.2014.12.3.186

access: open

type: Journal Article

metadata version: 2021-02-16

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  - https://dblp.org/rec/journals/jicce/PanthSYL14
Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim:
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering 12(3): 186-192 (2014)

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