default search action

combined dblp search
author search
venue search
publication search

ask others

"The bond Strength Measurement of silicon-silicon bonding wafers Based on ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Liguo Chen, Tao Chen, Lining Sun (2006)

> Home

Details and statistics

DOI: 10.1142/S0219878906001088

access: closed

type: Journal Article

metadata version: 2020-10-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijia/ChenCS06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijia/ChenCS06
Liguo Chen, Tao Chen, Lining Sun:
The bond Strength Measurement of silicon-silicon bonding wafers Based on Crack Opening Method. Int. J. Inf. Acquis. 3(4): 339-347 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.

last updated on 2020-10-22 17:01 CEST by the dblp team

all metadata released as open data under CC0 1.0 license

see also: Terms of Use | Privacy Policy | Imprint

dblp was originally created in 1993 at:

since 2018, dblp has been operated, funded, and maintained by:

Schloss Dagstuhl - Leibniz Center for Informatics is a member of the Leibniz Association and is funded by the federal government of Germany and the states of Germany, especially Saarland and Rhineland‑Palatinate.