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"Effect of annealing residual stress on mobility of TSV vertical switch."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Fengjuan Wang et al. (2024)

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DOI: 10.1587/ELEX.21.20240208

access: open

type: Journal Article

metadata version: 2024-11-27

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  dblp key:
  - journals/ieiceee/WangRYYYJL24
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  persistent URL:
  - https://dblp.org/rec/journals/ieiceee/WangRYYYJL24
Fengjuan Wang, Jiashuo Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang, Kai Jing, Qian Li:
Effect of annealing residual stress on mobility of TSV vertical switch. IEICE Electron. Express 21(10): 20240208 (2024)

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last updated on 2024-11-27 21:02 CET by the dblp team

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