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ORCID"Image-Based Accelerated Prediction of Thermal Properties of Package ..."
- Jeong-Hyeon Park
, Jaechoon Kim, Sukwon Jang, Sungho Mun, Eun-Ho Lee:
Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model. IEEE Access 13: 107926-107935 (2025)
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