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"3D Printed Electronics With High Performance, Multi-Layered Electrical ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Chiyen Kim et al. (2017)

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DOI: 10.1109/ACCESS.2017.2773571

access: open

type: Journal Article

metadata version: 2023-03-10

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Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker:
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect. IEEE Access 5: 25286-25294 (2017)

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