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"Advanced Material Formulation and Processing Parameter Optimization for ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Nornazurah Nazir Ali et al. (2026)

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DOI: 10.1109/ACCESS.2025.3648396

access: open

type: Journal Article

metadata version: 2026-01-20

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  dblp key:
  - journals/access/AliZRS26
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  persistent URL:
  - https://dblp.org/rec/journals/access/AliZRS26
Nornazurah Nazir Ali, Hidayat Zainuddin, Jeefferie Abd Razak, Suzie Sukarti:
Advanced Material Formulation and Processing Parameter Optimization for High-Voltage Polymeric Insulation Blends: A Two-Level Factorial and ANOVA Study. IEEE Access 14: 1493-1507 (2026)

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last updated on 2026-01-20 16:10 CET by the dblp team

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