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"A bonding technique for electric circuit prototyping using conductive ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe (2022)

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DOI: 10.1145/3526114.3558670

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-03

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  dblp key:
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Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe:
A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron. UIST (Adjunct Volume) 2022: 85:1-85:3

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