"Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for ..."

Paulina Fusiara et al. (2018)

> Home

Details and statistics

DOI: 10.1109/RECONFIG.2018.8641727

access: closed

type: Conference or Workshop Paper

metadata version: 2019-02-17

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/reconfig/FusiaraSPHKSH18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/reconfig/FusiaraSPHKSH18
Paulina Fusiara, Gijs Schoonderbeek, Johan Pragt, Leon Hiemstra, Sjouke Kuindersma, Menno Schuil, Grant Hampson:
Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards. ReConFig 2018: 1-8

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.