"3D Hybrid Bonded EIC-PIC Integration and Packaging Technologies."

S. J. Ben Yoo (2026)

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DOI: —

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type: Conference or Workshop Paper

metadata version: 2026-06-09

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S. J. Ben Yoo:
3D Hybrid Bonded EIC-PIC Integration and Packaging Technologies. OFC 2026: 1-3

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