"An ultra low power 3D integrated intra-chip silicon electronic-photonic link."

Erman Timurdogan et al. (2015)

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DOI: 10.1364/OFC.2015.TH5B.8

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-22

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Erman Timurdogan, Zhan Su, Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Chen Sun, Gerald Leake, Douglas D. Coolbaugh, Benjamin R. Moss, Michele Moresco, Vladimir Stojanovic, Michael R. Watts:
An ultra low power 3D integrated intra-chip silicon electronic-photonic link. OFC 2015: 1-3

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