"3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged ..."

Damien Lambert et al. (2023)

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DOI: 10.23919/OFC49934.2023.10116222

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-01

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Damien Lambert, Jeff Rahn, Majid Sodagar, Murtaza Askari, Paveen Apiratikul, John Y. Spann, Thang Pham, Yishen Huang, Stephen Krasulick:
3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration. OFC 2023: 1-3

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