"TriCooling-Sim: Efficient Thermal Simulation for High-Density Micro AI ..."

Jinyang Guo et al. (2025)

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DOI: 10.1007/978-3-032-10466-3_19

access: closed

type: Conference or Workshop Paper

metadata version: 2026-01-12

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Jinyang Guo, Xinkai Wang, Jing Wang, Xiaofeng Hou, Chao Li, Minyi Guo:
TriCooling-Sim: Efficient Thermal Simulation for High-Density Micro AI Data Centers. NPC (2) 2025: 227-239

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