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"Dual-Purpose Metal Inter-layer Via Utilization in Monolithic ..."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Madhava Sarma Vemuri, Umamaheswara Rao Tida (2020)

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DOI: 10.1109/MWSCAS48704.2020.9184698

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-03

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  - https://dblp.org/rec/conf/mwscas/VemuriT20
Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. MWSCAS 2020: 424-427

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