"Managing signal, power and thermal integrity for 3D integration."

Madhavan Swaminathan (2014)

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DOI: 10.1109/TEST.2014.7035313

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Madhavan Swaminathan:
Managing signal, power and thermal integrity for 3D integration. ITC 2014: 1

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