"Evaluation of TSV and micro-bump probing for wide I/O testing."

Ken Smith et al. (2011)

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DOI: 10.1109/TEST.2011.6139180

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Ken Smith, Peter Hanaway, Mike Jolley, Reed Gleason, Eric Strid, Tom Daenen, Luc Dupas, Bruno Knuts, Erik Jan Marinissen, Marc Van Dievel:
Evaluation of TSV and micro-bump probing for wide I/O testing. ITC 2011: 1-10

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