"Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open ..."

Sandeep Kumar Goel et al. (2024)

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DOI: 10.1109/ITC51657.2024.00068

access: closed

type: Conference or Workshop Paper

metadata version: 2025-05-23

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Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar:
Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. ITC 2024: 451-459

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