"Chiplets' Die-to-Die Interconnect Repair Language (IRL)."

Po-Yao Chuang, Erik Jan Marinissen (2025)

> Home

Details and statistics

DOI: 10.1109/ITC58126.2025.00009

access: closed

type: Conference or Workshop Paper

metadata version: 2026-02-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/itc/ChuangM25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/itc/ChuangM25
Po-Yao Chuang, Erik Jan Marinissen:
Chiplets' Die-to-Die Interconnect Repair Language (IRL). ITC 2025: 37-44

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.