"Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated ..."

Dylan C. Stow et al. (2016)

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DOI: 10.1109/ISVLSI.2016.133

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Dylan C. Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie:
Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. ISVLSI 2016: 637-642

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