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"Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV)."

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

Hiroshi Yoshikawa et al. (2009)

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DOI: 10.1109/ISSCC.2009.4977515

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-06

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  dblp key:
  - conf/isscc/YoshikawaKTINTASMFT09
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  persistent URL:
  - https://dblp.org/rec/conf/isscc/YoshikawaKTINTASMFT09
Hiroshi Yoshikawa, Atsuko Kawasaki, Tomoaki Iiduka, Yasushi Nishimura, Kazumasa Tanida, Kazutaka Akiyama, Masahiro Sekiguchi, Mie Matsuo, Satoru Fukuchi, Katsutomu Takahashi:
Chip Scale Camera Module (CSCM) using Through-Silicon-Via (TSV). ISSCC 2009: 476-477

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