"Repeated On-Chip Interconnect Analysis and Evaluation of Delay, Power, and ..."

Ling Zhang et al. (2007)

> Home

Details and statistics

DOI: 10.1109/ISQED.2007.139

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-29

- view
  authority control:
- export record
  dblp key:
  - conf/isqed/ZhangCYHC07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isqed/ZhangCYHC07
Ling Zhang, Hongyu Chen, Bo Yao, Kevin Hamilton, Chung-Kuan Cheng:
Repeated On-Chip Interconnect Analysis and Evaluation of Delay, Power, and Bandwidth Metrics under Different Design Goals. ISQED 2007: 251-256

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.