"Electrical and Thermal Analysis for System-in-a-Package (SiP) ..."

Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai (2003)

> Home

Details and statistics

DOI: 10.1109/ISQED.2003.1194736

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

- view
  authority control:
- export record
  dblp key:
  - conf/isqed/WangSD03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isqed/WangSD03
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai:
Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform. ISQED 2003: 229-234

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.